资料介绍
RK3066_MID5
4
3
2
1
CONTENT INDEXING
D
PCB POWER WIRE WIDTH INDICATE
above 80 miles above 50 miles above 30 miles
No indicate
D
C
01. INDEX 02.Modify note 03.Block Diagram 04.SYSTEM POWER DIAGRAM 05.DC/CHARG 06.SYSTEM POWER 07.USB OTG/VIB 08.DDR3 09.FLASH/SD 10.GPIO 11.AUDIO 12.LCD PANEL 13.TOUCH PANEL 14.HDMI/ATSC 15.CAMERA/G_SENSOR/KEY/COMP/IR 16.WIFI/3G 17.GPS
above 16 miles Under needs
C
B
6 LAYERS PCB STACK
TOP GND POWER(S1) Adjust S1(S2) GND(POWER) S2(BOTTOM) Core Prepreg 3.94MIL(0.1mm) 3313*1 4.0MIL(0.10mm) 1oz(35um) 1oz(35um) Hoz(18um) + plating copper(18um) Hoz(18um) + plating copper(18um) Prepreg Core 3313*1 4.0MIL(0.10mm) 3.94MIL(0.1mm) 1oz(35um) 1oz(35um)
B
A
A
福州瑞芯微电子有限公司
Title:
Index
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