资料介绍
相机模组结构图Camera Module
Lens : Barrel Lens .
Housing : Lens Focusing
IR Cut Filter : Glass
Image Sensor : CMOS Image Sensor Image Sensor+ISP, Image Sensor only . Substrate() : HPCB, Rigid Flex PCB, Flex PCB, Ceramic, Glass .
COB vs COF
Camera Module -COB (Chip on Board) : Bare Chip PCB Flexible Board , Wire Bonding Housing Ass’y - COF (Chip on FPCB) : Bare Chip FPCB Flip-chip Bonding Housing Ass’y
Structure of AF Module
Sensor AF Control chip Micro step Motor , Motor Driver IC Motor Focusing . Edge Detection Motor Motor , Focusing . Phone Baseband chip Software , Baseband . , Module Chip Phone Focusing .
Fixed Focus Lens
-. Focus Range : 20cm ~ Infinite -. Camera Phone Ratio of Mobile Phone : 2
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