资料介绍
手机摄像模组的制作流程 Agenda
1. 2. 3. 4.
1.
Substrate
Image Sensor
(Holder) IR Cut DSP or IC
Flex Cable (FPC)
Image Sensor
Sensor SMT ,
PLCC/CLCC
, (Lens Holder)
Sensor
bare die chip scale Substrate , (Lens Holder)
ACF
Hot Bar
Double Sided
Substrate Based
Ceramic Substrate Based
Gold Finger Connector
B-To-B Connector
2.
Wire Bonding CSP Flip Chip FPC #1
我要上传