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WiFi Module production flow

资料介绍
WiFi Module production flowWiFi Module Production Flow

SiP (System in Package Technology)
It is the alternative of the SOC(System on Chip) It is much more than a package concept Functional system or subsystem into one package An advanced packaging technology of module Product Multi-Process of the components assembly on substrate Chip level interconnected technology (Flip chip, Chip stacking, Multi-Chip, Wire bonding) Quite often includes passive components (SMD, Embedded R / L / C)

Download F/W Tx/Rx Test Throughput Test MAC/Domain

Surface Mounting
0201 Chip Component Capability CSP and Flip Chip Bonding Lead Free Soldering N2 Atmosphere Soldering Reflow CFC Free Solvent Clean

Singulation
Saw Cutting Snapping

Testing
Device type:
WLAN Module/Device(802.11a/g/b) , Power Amplifier/RF FEM, F……
标签:Moduleproduction
WiFi Module production flow
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