首页|嵌入式系统|显示技术|模拟IC/电源|元件与制造|其他IC/制程|消费类电子|无线/通信|汽车电子|工业控制|医疗电子|测试测量
首页 > 分享下载 > 消费类电子 > NXP BGB203 AND BGB204技术方案

NXP BGB203 AND BGB204技术方案

资料介绍
BGB203-204Complete, plug-and-play Bluetooth 1.2 solutions in a single package

NXP Bluetooth 1.2 SiPs BGB203, BGB204
These complete Bluetooth 1.2 solutions, designed for a range of mobile applications, provide complete, plug-and-play operation in a single package as small as 49 mm. They also support coexistence with 802.11 WLAN.
Key features } Complete, fully tested Bluetooth 1.2 SiP - Supports Bluetooth 1.2 specification, including eSCO - Low total cost of ownership } Ultra-small HVQFN package - BGB203 (Flash): 7 x 8 x 1.3 mm - BGB204 (ROM): 7 x 7 x 1.0 mm (footprint compatible with BGB203) } Highly integrated solution - No RF-critical layout or external components - Integrated RF filters, balun, switches - ARM7 processor - Embedded 268k Flash (BGB203) or ROM (BGB204) - High-performance Bluetooth 1
标签:BGB203-204
NXP BGB203 AND BGB204技术方案
本地下载

评论