[Broadcom] BCM2074x 第四代先進藍牙耳機系...

20740-PB01-RBCM20740


Brief
SUMMARY OF BENEFITS
Ideal for low-cost, footprint-challenged headset designs Enhanced audio quality, reduced charging times, circuitry, and
application profiles

ROM-BASED, SINGLE-MICROPHONE, MONO HEADSET IC IN 65 NM
FEATURES
Single-chip Bluetooth 3.0 transceiver supporting Enhanced Data
Rate (EDR) and Bluetooth 2.1, 2.0, 1.2, and 1.1 with backward compatibility

Integrated audio quality enhancement features through SmartAudio
Packet-loss concealment Bit error concealment Sidetone

A ROM-based audio quality enhanced headset, enabling a
revolutionary reduction in the bill of materials (BOM) for low-end mono headsets

Support for digital microphones Supports microphone and speaker equalization High-performance ARM Cortex-M3 processor On-chip SRAM and ROM Extens