资料介绍
ES8323+RK30665
4
3
2
1
CONTENT INDEXING
01. INDEX 02.Modify note 03.Block Diagram 04.SYSTEM POWER DIAGRAM 05.DC/CHARG 06.SYSTEM POWER 07.USB OTG/VIB 08.DDR3 09.FLASH/TF CARD 10.GPIO 11.AUDIO 12.LCD PANEL 13.TOUCH PANEL/Light Sensor 14.HDMI 15.CAMERA/G_SENSOR/KEY/COMP 16.WIFI/3G 17.GPS
PCB POWER WIRE WIDTH INDICATE
above 80 miles above 50 miles above 30 miles above 16 miles
No indicate D
D
Under needs
C
C
B
6 LAYERS PCB STACK
TOP Prepreg GND Core POWER(S1) Adjust S1(S2) Core GND(POWER) Prepreg S2(BOTTOM) 3313*1 4.0MIL(0.10mm) Hoz(18um) + plating copper(18um) 3.94MIL(0.1mm) 1oz(35um) 1oz(35um) 3.94MIL(0.1mm) 1oz(35um) 3313*1 4.0MIL(0.10mm) 1oz(35um) Hoz(18um) + plating copper(18um)
B
A
A
Title: File:
Create Date: Modify Date:
Monday, August 20, 2012 REV: Page Num: 1 Page Total: 16
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