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3G TD 芯片 方案 比较

资料介绍
TD-SCDMA MarketingTD-SCDMA MARKETING STATUS

TD VENDOR PRODUCT OVERVIEW








The competition mainly focuses on HSDPA’s performance and launch time. CYIT’s TXTD2100, which supports HSDPA 1.1M bps, leads the schedule of HSDPA, but it can’t support dual mode AHO. Leadcore and Spreadtrum support MBMS on their R4 product firstly, but no leading advantage on R5 product to support it. T3G’s 7210 leads other competitors on the TTM of 2.8M HSDPA, TD dual band and the maturity of TD/EDGE dual mode AHO.

Vendor Landscape

7208 (PNX5220+TD60186)

7210 (PNX5225+TD60291)
BB (2chips: 2DBB) 90nm
HSDPA2.8M/EDGE, TD dual band MBMS (256K)

6718 (PNX6718)
BB (1chip: 1DBB) 65nm
HSPA(2.8M/2.2M)/EDGE, TD dual band

T3G

BB (3chips: 2DBB + 1ABB) 90nm
AHO EDGE

A2000+ (LeMansLCR+)

A2000+H (Laguna)A2000+TV (LeMansLCR+)
BB (2c……
标签:TD-SCDMAMarketing
3G TD 芯片 方案 比较
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