NOKIA手机-SMT工艺文件.doc

NOKIA手机-SMT工艺文件


Contents

1. SHIPPING, STORAGE AND PRODUCTION ENVIRONMENT 2
1.1 General shipping and storage conditions 2
1.2 Storage and handling conditions for solder paste 2
1.3 Storage conditions for underfill epoxy materials 3
1.4 Storage and handling conditions for printed wiring boards [PWBs] 4
1.5 Shelf life time for different component categories 5
1.6 Drying (baking) moisture sensitive devices 6
2. PASTE SPECIFICATIONS 7
3. STENCIL PRINTING PROCESS SPECIFICATIONS 8
3.1 Squeegee 8
3.2 Stencil 8
3.3 Support tables 9
3.4 Printing process parameters (stencil printing) 10
4. Statistical Printing Process Control, SPPC 11
4.1 Alarm and control limit settings 11
4.2 Actions when the machine alarms 12
4.3 Handling of statistical p