资料介绍
OVERVIEW_PHYSICAL_LAYER_FOR_3G_LOW_CHIP_RATE_TDD_SYSTEMSST JOURNAL OF SYSTEM RESEARCH - VOL.1 - NUMBER 1
OVERVIEW OF PHYSICAL LAYER FOR 3G LOW CHIP RATE TDD SYSTEMS
Ser Wah OH Muralidhar KARTHIK Christopher A. ALDRIDGE STMicroelectronics
This paper reviews the 3GPP standard based on TD-SCDMA technology (termed UMTS Terrestrial Radio Access Low Chip Rate Time-Division Duplex UTRA LCR-TDD). We first present a brief overview of the system followed by more detailed descriptions of the physical layer of UTRA LCR-TDD. We then discuss the various features of UTRA LCR-TDD and explain the rationale of the selection of these features by focusing on the unique features of UTRA LCR-TDD rather than offering lengthy discussions on every single feature common among different systems. Finally, some success factors for 3G are also mentioned for positioning o